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Patent Searching and Data


Title:
WIRING FORMING METHOD
Document Type and Number:
Japanese Patent JPH0817827
Kind Code:
A
Abstract:

PURPOSE: To form a wiring having a forward tapered shaped cross-section by a method wherein the third aperture of a forward tapered-shaped cross-section in formed on a lower layer resist, and the wiring is formed by laminating wiring material on the base layer through the third aperture part.

CONSTITUTION: A first aperture part 32a, corresponding to an expected region 34 for formation of a wiring, is formed on an upper layer resist 32 by exposing and developing the upper layer resist 32. A light-shielding film 32 is etched through the first aperture part 32a, and the second aperture part 30a, corresponding to the expected region 34 for formation of a wiring, is formed on the light- shielding film 30. The exposed lower layer resist 28 is developed, and the third aperture part 28a, corresponding to the expected region 34 for formation of a wiring, is formed on the lower layer resist 28. A wiring material 28 is laminated on a base layer 26 through the third aperture part 28a, and a wiring 40 is formed. As a result, the cross-sectional shape of the wiring can be formed into a forward tapered shape.


Inventors:
SUMIYA MASANORI
Application Number:
JP14826394A
Publication Date:
January 19, 1996
Filing Date:
June 29, 1994
Export Citation:
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Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L21/3205; (IPC1-7): H01L21/3205
Attorney, Agent or Firm:
Takashi Ogaki