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Patent Searching and Data


Title:
POLYPHENYLENE SULFIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0616935
Kind Code:
A
Abstract:

PURPOSE: To obtain a polyphenylene sulfide resin composition useful as precision molded article, etc., having excellent fluidity and mold release characteristics, showing low barrier properties by blending specific amounts of a specific polyphenylene sulfide resin, a mold release agent such as polyethylene wax and an inorganic filler.

CONSTITUTION: The composition comprises (A) 100 pts.wt. polyphenylene sulfide resin having 50-150g/10 minutes melt flow rate measured under a condition with an orifice having 0.0825 ± 0.0002 inch, 1.250±0.001 inch orifice length under 1,270g load at 600±1°F and ≥1wt.% low-molecular weight component extracted in a suspension state at normal temperature by using methylene chloride, (B) 0.1-3 pts.wt. mold release agent composed of polyethylene wax, ethylene-propylene copolymer wax, a compound of formula I [X is CO-R (R is 6-24C alkyl or alkenyl)] or a compound of formula II (n is l-3) and (C) 20-300 pts.wt. filler such as glass fibers, talc or glass powder.


Inventors:
WAKABAYASHI NOBUKATSU
OMURA JUNICHIRO
Application Number:
JP17450492A
Publication Date:
January 25, 1994
Filing Date:
July 01, 1992
Export Citation:
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Assignee:
MITSUBISHI CHEM IND
International Classes:
C08K5/20; C08K5/3477; C08K5/54; C08K5/5435; C08K7/14; C08L81/02; (IPC1-7): C08L81/02; C08K5/20; C08K5/3477; C08K5/54; C08K7/14
Attorney, Agent or Firm:
Hasegawa Hajime (1 person outside)