Title:
【発明の名称】金属被覆方法
Document Type and Number:
Japanese Patent JPH0738420
Kind Code:
B2
Abstract:
In a maskless metal cladding process for plating an existing metallurgical pattern (13), a protective layer (16) is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay (17). The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.
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Inventors:
Lester Win Heron
Ananda Hoskea Kumar
Robert Wolf Newfar
Ananda Hoskea Kumar
Robert Wolf Newfar
Application Number:
JP20073185A
Publication Date:
April 26, 1995
Filing Date:
September 12, 1985
Export Citation:
Assignee:
International Business Machines Corporation
International Classes:
H01L23/12; C23C10/04; H01L21/388; H01L21/48; H05K3/24; H05K1/03; H05K1/09; (IPC1-7): H01L23/12; H05K3/24
Domestic Patent References:
| JP58164249A |
Attorney, Agent or Firm:
Kiyoshi Goda (2 outside)