PURPOSE: To cut down selective printed-wiring cost of conductive connection reducing the manufacturing cost thereof.

CONSTITUTION: A selective printed-wirings 10 arranged on a substrate are composed of respective connecting terminal patterns 12a, 12b closely arranged in the tangled state with each other at respective ends of printed-wirings 11a, 11b. During the packaging step, the selective printed-wirings 10 are conduction- connected by conventional reflowing step. That is, a solder paste 13 arranged in specific positions is heated to be melted down so that the parts between respective connecting terminal patterns 12a, 12b closely arranged in the tangled state with each other may be conduction-connected. Accordingly, the selective printed-wirings 10 can be conduction-connected thereby enabling the manufacturing cost thereof to be cut down.