PURPOSE: To obtain the composition which is easily moldable, does not form any water as a by-product during curing and can provide a cured product having high heat resistance and excellent mechanical properties by mixing a polymaleimide compound with a specified compound having a plurality of specified groups and an inorganic filler.
CONSTITUTION: The composition is prepared by mixing a polymaleimide compound (particularly desirably an aromatic bismaleimide compound), a methallylphenyl ether compound and/or a methallylphenol compound each of which contains at least two methallyl groups in the molecule (desirably a methallylphenol compound having two methallyl groups) and an inorganic filler. This composition is easily moldable, does not form any water as a by-product during curing, can provide a cured resin having excellent heat resistance and mechanical properties, and can be used as an electrical insulation material or a molding or laminating material for prepregs or structural materials.
TAKEI MASAO
KIMURA KAORU
