Title:
【発明の名称】リードフレームの製造方法
Document Type and Number:
Japanese Patent JP2648353
Kind Code:
B2
Abstract:
PURPOSE:To realize a lead frame having no risk of migration, etc., by a method wherein the side end surface of circuit patterns of a portion which need be plated is formed at the least, a predetermined partial plating is performed on a require place, then circuit patterns of the remaining unworked part are formed. CONSTITUTION:Circuit patterns of a place, containing inner leads 10 at the least, with need be plated are formed. Circuit patterns of a place which is inward of a dam bar 14 at the least and which is exposed outwardly from the main body of a semiconductor device when it is assembled as a semiconductor device, are not formed. That is, circuit patterns are not formed between outward of a mold line A and the dam bar 14, and over a required range inward of the mold line A, but circuit patterns of this part is formed after partial plating is performed on a part to be plated. As a result, the problem of migration will not arise even in the case where the partial plating is a silver plating coat. Man-hours are reduced and the costs can be decreased.
Inventors:
SHIMIZU MITSUHARU
MYAZAWA MITSUHIRO
MYAZAWA MITSUHIRO
Application Number:
JP30836188A
Publication Date:
August 27, 1997
Filing Date:
December 06, 1988
Export Citation:
Assignee:
SHINKO DENKI KOGYO KK
International Classes:
H01L23/50; H01L21/50; H01L21/60; (IPC1-7): H01L23/50; H01L21/50; H01L21/60
Domestic Patent References:
| JP55151357A |
Attorney, Agent or Firm:
Takao Watanuki (1 outside)