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Patent Searching and Data


Title:
【発明の名称】木片セメントパネルの製造方法
Document Type and Number:
Japanese Patent JPH0628847
Kind Code:
B2
Abstract:
PURPOSE:To enhance shock resistance and strength without deteriorating fire resistance and suitability for cutting and to make the title panel lightweight by supplying and laying the sheetlike material on the accumulated layer of the mixture of lumber chips and cement and thereafter accumulating and laminating the mixture of the lumber chips and cement on the sheetlike material and pressing them to deform the sheetlike material so that it is laid along the accumulated layer. CONSTITUTION:A fine layer F1 is formed by kneading fine lumber chips 1a with cement 2, supplying and accumulating the kneaded material. Successively the downside accumulated layer A1 is formed by accumulating S1 the mixture of the lumber chips 1b, 1a of all sizes and cement 2. Thereafter the easily deformable sheetlike material 3 is supplied and laid thereon. Then the mixture of the lumber chips 1b, 1a of all sizes and cement 2 is accumulated S2. Finally a fine layer F2 of the upside is formed by accumulating the kneaded material of the fine lumber chips 1a and cement 2 and then the accumulated layer A2 of the upside is formed. When this accumulated mat B is cut and superposed and these mats E are pressed, the sheetlike material 3 is pressed by the coarse lumber chips 1b and compositely unevened and deformed and then bonding properties are enhanced. In this pressurized state, a cement chip panel is clamped, hardened, aged and dried.

Inventors:
MISHIRO MASASHI
SATO KAZUHIRO
NEMOTO HIROYA
Application Number:
JP9485590A
Publication Date:
April 20, 1994
Filing Date:
April 09, 1990
Export Citation:
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Assignee:
DAIKEN TRADE & INDUSTRY
International Classes:
C04B18/26; B28B3/02; B28B5/00; B32B13/02; C04B28/04; (IPC1-7): B28B3/02; B28B5/00
Attorney, Agent or Firm:
Yoshiaki Mori