Title:
MOLDING MATERIAL OF THERMOSETTING RESIN
Document Type and Number:
Japanese Patent JPS5823853
Kind Code:
A
Abstract:
PURPOSE: The titled material capable of reducing extremely a shrinkage factor during molding, a shrinkage factor and water absorption of a molded article, obtained by adding an inorganic hollow material to a thermosetting resin.
CONSTITUTION: A thermosetting resin preferably a phenol resin or an amino resin is blended with an inorganic hollow material such as glass ballon, silas ballon, fly ash balloon, etc. The amount of the hollow material added is 10W 60wt%, preferably 20W50wt% based on the total amount of the molding material.
Inventors:
YAMADA TOSHIYASU
ISHIDA TOSHIO
ISHIDA TOSHIO
Application Number:
JP12214081A
Publication Date:
February 12, 1983
Filing Date:
August 03, 1981
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08K7/00; C08K7/16; C08K7/24; C08L61/00; C08L61/04; C08L67/00; C08L101/00; (IPC1-7): C08K7/24; C08L61/00; C08L101/00
Attorney, Agent or Firm:
Toshimaru Takemoto