【発明の名称】多層配線基板

Title:

【発明の名称】多層配線基板

Document Type and Number:

Japanese Patent JP3060729

Kind Code:

B2

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Inventors:

Shinichiro Miyaji
Kenji Kida
Tomoaki Ueda

Application Number:

JP19537092A

Publication Date:

July 10, 2000

Filing Date:

July 22, 1992

Export Citation:

Assignee:

Toray Industries, Inc.

International Classes:

B32B15/08; B32B27/00; H05K1/03; H05K3/46; (IPC1-7): H05K3/46; B32B15/08; B32B27/00; H05K1/03

Domestic Patent References:

Attorney, Agent or Firm:

Toshimitsu Ban

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