Title:
ELECTROLESS-PLATING SOLUTION AND PREPARING METHOD OF BATH USED THEREFOR
Document Type and Number:
Japanese Patent JPH0673554
Kind Code:
A
Abstract:
PURPOSE: To obtain a gold electroless-plating soln. capable of plating at a high rate and excellent in stability and to prepare the bath to be used therefor.
CONSTITUTION: The compositional ratio of two kinds of complexing agents having a different complex forming constant, an SO32- salt and an S2O32- salt is optimized to simultaneously realize a high plating rate and soln. stability. In this case, (Au(SO3)2)3- is firstly formed, and then Na2S2O3 is added to partly convert (Au(SO3)s)3- into (Au(SO3)(S2O3))3-. As a result, the forming reaction of the chemical species such as S4O62- and fine gold particle is suppressed by this bath preparing method.
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Inventors:
TAKEHARA HIROKO
Application Number:
JP22971492A
Publication Date:
March 15, 1994
Filing Date:
August 28, 1992
Export Citation:
Assignee:
HITACHI LTD
International Classes:
C23C18/44; (IPC1-7): C23C18/44
Attorney, Agent or Firm:
Ogawa Katsuo
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