Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS599926
Kind Code:
A
Abstract:
PURPOSE:To remove chips completely by scattering a liquid containing fine bubbles to a section to be cut or processed when a semiconductor substrate is cut or processed by using a rotatory grindstone. CONSTITUTION:The semiconductor substrate 2 placed on a rotary table 1 is sucked under vacuum, and the rotatory grindstone 3 fitted at one end of the substrate 2 is moved in the direction of the substrate 2 and the substrate 2 is cut or processed up to a desired shape. Water 5 from an injection pipe 4 is sprayed against the section to be cut or processed at that time, but next water introducing ports 8, 9 are branched and set up between the pipe 4 and a water introducing port 6 connecting to the pipe 4 at that time. According to such constitution, air containing fine bubbles or an inert gas is introduced to the introducing port 8, and a liquid in which ammonia is mixed into deionized water as a substance decreasing resistance is introduced into the introducing port 9. A liquid from which alkali ions are removed is used as the deionized water at that time. Accordingly, charges do not store on chips, and the adhesion thereof to the substrate 2 is removed in cooperation with bubbles.
Inventors:
KITAHIRO ISAMU
TAKEHASHI NOBUTOSHI
TAKEHASHI NOBUTOSHI
Application Number:
JP11945882A
Publication Date:
January 19, 1984
Filing Date:
July 08, 1982
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/301; H01L21/304; (IPC1-7): H01L21/304
Domestic Patent References:
| JP36022692A | ||||
| JPS4745271A | ||||
| JPS5128754A | 1976-03-11 |
Attorney, Agent or Firm:
Toshio Nakao