PURPOSE: To realize a multilayer interconnection structure which is excellent in flattening the steps caused by wirings, by using as an interlayer insulating film a composition including a polyimide based resin precursor.
CONSTITUTION: Aromatic tetrabasicacid dianhydride of 1mol and monovalent alcohol having at most four carbons/alcohol derivative of 0.1-1.0mol are heated in a solvent including a water content not more than 0.1wt.%, and a part of aromatic tetrabasicacid dianhydride is made into diester. Then, the foregoing material is made to react on an aromatic diamine compound, which has amino groups in the unsymmetrical places with respect to molecular major axis, and other diamine compounds of 0.8-1.2mol. Subsequently, the resultant composition including a polyimide based resin precursor is applied to a base material 1 having a wiring layer 2 wherein circuit patterns are formed, and an interlayer insulating film 5 is formed on the wiring layer 2 while curing the composition. Therefore, when an upper wiring layer 4 is formed on the interlayer insulating film 5 after forming through holes in the film 5, a highly reliable multilayer interconnection structure, wherein any step caused by making wiring layers into a multilayer interconnection is scarcely generated, can be realized.
SEKINE HIROYOSHI
SATO NINTEI
