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Title:
【発明の名称】道路等のための舗装材
Document Type and Number:
Japanese Patent JP2835510
Kind Code:
B2
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JP2016084385RESIN COMPOSITION, RESIN MOLDING, AND SURFACE-MOUNTED LIGHT EMITTING DEVICE HAVING THE RESIN MOLDING
Inventors:
MIWA KEIICHIRO
Application Number:
JP34007196A
Publication Date:
December 14, 1998
Filing Date:
December 19, 1996
Export Citation:
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Assignee:
MIWA KEIICHIRO
International Classes:
C08K3/22; C04B28/04; C08L95/00; E01C3/00; (IPC1-7): C08L95/00; C08K3/22; E01C3/00
Domestic Patent References:
JP790271A
JP7187736A
JP8209058A
JP3115607A
Attorney, Agent or Firm:
Hironori Takenori



 
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