Title:
【発明の名称】研磨パッド
Document Type and Number:
Japanese Patent JP2003510826
Kind Code:
A
Abstract:
A polishing pad for use with a polishing fluid has, a polishing layer, a window in an opening through the polishing layer, and a fluid impermeable layer spanning across the polishing layer and the window and the opening to provide an uninterrupted continuous barrier to leakage of polishing fluid, the fluid impermeable layer having thereon an adhesive forming bond seals with the polishing layer and the window.
Inventors:
Freeman, Peter W
Eppert, Stanley E. Jr.
Saikin, Alan H
Asevedo, Marco A
Eppert, Stanley E. Jr.
Saikin, Alan H
Asevedo, Marco A
Application Number:
JP2001526332A
Publication Date:
March 18, 2003
Filing Date:
September 28, 2000
Export Citation:
Assignee:
Rodel Holdings, Inc.
International Classes:
B24B37/20; B24B49/12; B24D7/12; B24D9/08; B24D13/14; H01L21/304; (IPC1-7): H01L21/304; B24B37/00
Domestic Patent References:
| JP2001291686A | 2001-10-19 | |||
| JPH09277162A | 1997-10-28 |
Attorney, Agent or Firm:
Hajime Tsukuni (2 outside)