PURPOSE: To provide a through hole wiring hoard which excels in moisture resistance, pressure cooker resistance and migration resistance by filling the through holes on a printed board with conductive resin composition which contains AgxCu1-x copper alloy.

CONSTITUTION: Conductive fine powder contained in conductive resin composition is copper alloy powder expressed by the average composition of AgxCu1-x (0.01≤x≤0.4, x is an atomic ratio) the silver concentration on the surface is higher than the average silver concentration and the silver concentration gradually increases from the internal to the surface. The average grain diameter of the copper alloy powder is 0.1-50μm and the shapes of the grain are sphere and/or scaly. The printed board is a paper-based resin wiring board with a 0.2-0.8% water absorption and a 0.5-0.3% moisture absorption. Therefore, the through hole wiring board which allows excellent moisture resistance, temperature cycle resistance and pressure cooker resistance without causing conduction deterioration and allows excellent silver migration resistance is provided.