Title:
WIRE BONDING APPARATUS
Document Type and Number:
Japanese Patent JPH0669267
Kind Code:
A
Abstract:
PURPOSE: To reduce damage to a metal fine wire due to operator's work, work time and mistake by eliminating a metal fine wire introducing operation by operator's forceps at the time of replacing the wire.
CONSTITUTION: A sprue 1 and a metal fine wire 5 are stored in a vessel 2 in a state to be passed through a guide 3 and a capillary 4. The sprue 1, the guide 3 and a nozzle 16 for injecting dry air are provided by mounting on a head 15 of an adapter 2. Thus, a manual operation is not required in an operation for holding the wire 5, and the wire 5 is not damaged.
Inventors:
SATO HIDEAKI
Application Number:
JP24268292A
Publication Date:
March 11, 1994
Filing Date:
August 19, 1992
Export Citation:
Assignee:
NEC CORP
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Sugano Naka
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