Title:
PRODUCTION OF RESIN SEALED SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH07112284
Kind Code:
A
Abstract:
PURPOSE: To improve the clearness of display mark to be marked on a resin sealed body of resin sealed semiconductor device.
CONSTITUTION: In the production method of a resin sealed semiconductor device, by which a display mark 6 is marked on one surface of a resin sealed body 2 added with a die parting agent by laser marking technology, before marking process to mark the display mark 6 on one surface of the resin sealed body by laser marking technology, the surface treatment process is provided to remove the die parting agent on one surface of the resin sealed body 2.
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Inventors:
KINOSHITA SHIYOUJI
KITANO KENJI
TODA NAOKI
KUMANO JUNICHI
YAGASAKI MATAYASU
SEIKI KAZUHIRO
KITANO KENJI
TODA NAOKI
KUMANO JUNICHI
YAGASAKI MATAYASU
SEIKI KAZUHIRO
Application Number:
JP25952193A
Publication Date:
May 02, 1995
Filing Date:
October 18, 1993
Export Citation:
Assignee:
HITACHI LTD
HITACHI TOKYO ELECTRONICS
HITACHI TOKYO ELECTRONICS
International Classes:
B23K26/00; H01L23/00; (IPC1-7): B23K26/00; H01L23/00
Attorney, Agent or Firm:
Akita Aki