Title:
【発明の名称】プリント基板のパターン検査装置
Document Type and Number:
Japanese Patent JP2942171
Kind Code:
B2
Abstract:
PURPOSE:To improve the throughput of inspection as a whole. CONSTITUTION:Processors 420, 430 can carry out pattern inspection of a printed substrate on which a conductive pattern is formed in relation to two types of inspection items, e.g. a land rupture, a pin-hole defect, etc. An edge extracting circuit and an edge expanding circuit 600 can extract the edge of the conductive pattern from an image of the printed substrate or an image practically equivalent to the image and produce an edge image and at the same time it magnifies the width of each part of the edge image and produces magnified edge image. Switching means 429, 439, 459 switch the inspection items mutually of the processors 420, 430 in a region regulated by the magnified edge image among images of the printed substrate and a region besides the former. Consequently, appropriate pattern inspection is possible while considering the defect generation sites.
Inventors:
HOKI TETSUO
Application Number:
JP14331795A
Publication Date:
August 30, 1999
Filing Date:
June 09, 1995
Export Citation:
Assignee:
DAINIPPON SUKURIIN SEIZO KK
International Classes:
G01N21/88; G01N21/93; G01N21/956; G06T1/00; G06T7/00; H05K3/00; (IPC1-7): G01N21/88; G06T7/00; H05K3/00
Domestic Patent References:
JP2163879A | ||||
JP264441A | ||||
JP636445A | ||||
JP271377A | ||||
JP63318453A |
Attorney, Agent or Firm:
Shigeaki Yoshida (2 outside)