Title:
【発明の名称】プローブ・チップ
Document Type and Number:
Japanese Patent JP2597228
Kind Code:
B2
Inventors:
Warren Lee Chisum
Application Number:
JP26370190A
Publication Date:
April 02, 1997
Filing Date:
October 01, 1990
Export Citation:
Assignee:
TEKTRONIX,INC.
International Classes:
G08C19/00; G01R1/067; H01R11/18; (IPC1-7): G08C19/00; G01R1/067; H01R11/18
Domestic Patent References:
| JP63159768U | ||||
| JP58172874U | ||||
| JP6196372U | ||||
| JP63107857U |
Attorney, Agent or Firm:
Toshiaki Morisaki