Title:
【発明の名称】処理システム
Document Type and Number:
Japanese Patent JP2879833
Kind Code:
B2
Abstract:
In order to subject a workpiece, such as a semiconductor wafer, to elevated pressures the workpiece is enclosed in a void (16) between two enclosure parts (6,7) which have been forced together by upper and lower actuators (12,13). The enclosure parts (6,7) are themselves enclosed in a vacuum chamber (1) evacuatable by a vacuum pumping system. The enclosure parts (6,7) are connected to the vacuum chamber by bellows (4,5).
Inventors:
JEFUERIIZU ANDORYUU AIZATSUKU
GURIIN GOODON ROBAATO
GURIIN GOODON ROBAATO
Application Number:
JP50756693A
Publication Date:
April 05, 1999
Filing Date:
October 22, 1992
Export Citation:
Assignee:
TORIKON TEKUNOROJIIZU LTD
International Classes:
C23C14/58; C23C26/00; C23C14/56; H01L21/00; H01L21/324; H01L21/677; H01L21/768; (IPC1-7): C23C14/58; C23C26/00
Domestic Patent References:
| JP2213471A | ||||
| JP2305964A | ||||
| JP2138417U | ||||
| JP3504522A |
Attorney, Agent or Firm:
Takashi Ishida (3 others)