Title:
【発明の名称】薄金属物質の製造
Document Type and Number:
Japanese Patent JP2001518693
Kind Code:
A
Abstract:
A process is disclosed whereby paste and ink PARMOD compositions printed on a thermally stable material and cured in an oven to create metal foil objects such as electronic circuits, instruments and decorations. The metal foil objects can be lifted onto adhesive substrates to produce electronic circuit boards and similar products.
Inventors:
Kid, Paul, H.
Application Number:
JP2000513717A
Publication Date:
October 16, 2001
Filing Date:
September 30, 1998
Export Citation:
Assignee:
Parelek, Incorporated
International Classes:
B32B15/08; B44C1/17; H01B13/00; H01L23/14; H05K3/20; H05K1/00; H05K1/09; H05K3/28; (IPC1-7): H05K3/20; B32B15/08; H01B13/00
Attorney, Agent or Firm:
Mikio Hatta (4 outside)