Title:
【発明の名称】半導体封止用樹脂組成物
Document Type and Number:
Japanese Patent JP3317481
Kind Code:
B2
Inventors:
Shinichi Iwasaki
Application Number:
JP31085196A
Publication Date:
August 26, 2002
Filing Date:
November 21, 1996
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08K3/22; C08G14/09; C08G59/62; C08K3/00; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08G59/62; C08K3/00; C08K3/22; C08L63/00
Domestic Patent References:
| JP9207271A | ||||
| JP1319562A | ||||
| JP8253557A | ||||
| JP8253558A | ||||
| JP8253559A | ||||
| JP8311142A | ||||
| JP9110954A | ||||
| JP9124775A | ||||
| JP6473748A | ||||
| JP6473749A | ||||
| JP1101658A | ||||
| JP8151505A |
Other References:
【文献】国際公開97/12925(WO,A1)