Title:
【発明の名称】樹脂封止型半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP3317951
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a resin sealed semiconductor device which is sealed with a resin and fixed with part of a lead frame and a heat spreader overlapped as contacted with each other. SOLUTION: The resin sealed semiconductor device includes a lead frame 14 having an island 12 having a semiconductor element 11 mounted thereon and an inner lead 13, a heat spreader 15 for dissipating heat generated in the semiconductor element 11. In this case, the heat spreader 15, a bottom 12a of the island and inner lead 13 are contacted with each other without any intervention of any adhesive agent, and part of the heat spreader 15 is sealed with resin as contacted with a periphery. As a result, the spreader 15 can enhance is heat diffusion efficiency.
Inventors:
Yoshinori Kawahara
Application Number:
JP2000021678A
Publication Date:
August 26, 2002
Filing Date:
January 31, 2000
Export Citation:
Assignee:
Kyushu NEC Corporation
International Classes:
H01L21/56; H01L23/28; H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
| JP8111490A | ||||
| JP8203943A | ||||
| JP9129783A | ||||
| JP4964373A | ||||
| JP60110146A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)