Title:
【発明の名称】レジスト塗布装置
Document Type and Number:
Japanese Patent JP2633106
Kind Code:
B2
Abstract:
A resist film coating apparatus comprises a resist receiving plate secured to a rotatable support plate carrying a wafer so as to be disposed along the outer periphery of the wafer, an interference type film thickness meter for measuring the thickness of a resist film spun out to the resist receiving plate, and modifying means for changing the revolution number of the support plate on the basis of a result of measurement by the film thickness meter such that a desired resist film thickness can be obtained.
Inventors:
TANIMOTO KEISUKE
Application Number:
JP11981791A
Publication Date:
July 23, 1997
Filing Date:
May 24, 1991
Export Citation:
Assignee:
SHAAPU KK
International Classes:
B05C11/08; B05C11/10; G03F7/16; G05B1/02; H01L21/00; H01L21/027; (IPC1-7): H01L21/027; B05C11/08; G03F7/16; G05B1/02
Domestic Patent References:
| JP1164034A | ||||
| JP2125326U |
Attorney, Agent or Firm:
Yoshiro Kurauchi (1 person outside)