Title:
【発明の名称】熱処理装置の封止構造
Document Type and Number:
Japanese Patent JP3106172
Kind Code:
B2
Abstract:
This invention relates to a sealing apparatus for use in heat treating apparatuses, ion injection apparatuses, etching apparatuses and other devices which require air sealing. Such devices may be used in semiconductor manufacturing. Mounting portions are formed in the sealing apparatus so as to separate an inner-side portion and an outer-side portion of a flange contact portion of a manifold and a process tube of a process container. Air is exhausted from the area between the inner-side portion and the outer-side portion of the flange contact portion of the manifold and the process tube. Two metal seal members are mounted to the mounting portions. These metal seal members have different surface processing thereon. The middle portion between the metal seal members is connected to an air exhaust source and air is exhausted to create a vacuum therein. This provides the sealing function to seal the process tube and the manifold.
Inventors:
Hiroshi Sekizuka
Application Number:
JP5309991A
Publication Date:
November 06, 2000
Filing Date:
February 26, 1991
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C23C16/44; F16J15/00; F27D7/06; H01L21/00; H01L21/205; H01L21/22; H01L21/265; H01L21/285; H01L21/302; H01L21/3065; H01L21/31; (IPC1-7): H01L21/205; C23C16/44; F27D7/06; H01L21/22; H01L21/31
Domestic Patent References:
| JP1287284A | ||||
| JP1123336U | ||||
| JP2369U | ||||
| JP62188135U |
Attorney, Agent or Firm:
Tetsuo Kobayashi