Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2855222
Kind Code:
B2
Inventors:
BABA HISAYA
Application Number:
JP33876489A
Publication Date:
February 10, 1999
Filing Date:
December 28, 1989
Export Citation:
Assignee:
KASHIO KEISANKI KK
International Classes:
H01L29/06; H01J1/30; H01J1/308; H01L29/66; (IPC1-7): H01J1/30; H01L29/06; H01L29/66