【発明の名称】半導体製造装置

Title:

【発明の名称】半導体製造装置

Document Type and Number:

Japanese Patent JP2530468

Kind Code:

B2

Inventors:

NISHIMURA TADASHI
KUMAGAI HIROMI
YONEYAMA SHIMAO

Application Number:

JP30527987A

Publication Date:

September 04, 1996

Filing Date:

December 02, 1987

Export Citation:

Assignee:

TOKYO EREKUTORON KK
MITSUBISHI DENKI KK

International Classes:

G03F7/20; H01L21/20; H01L21/268; H01S3/00; H01S3/10; (IPC1-7): H01S3/10; G03F7/20; H01L21/20; H01L21/268

Domestic Patent References:

JP6341116U

Attorney, Agent or Firm:

Hajime Ohara

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