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Title:
【発明の名称】半導体製造装置
Document Type and Number:
Japanese Patent JP2530468
Kind Code:
B2
Inventors:
NISHIMURA TADASHI
KUMAGAI HIROMI
YONEYAMA SHIMAO
Application Number:
JP30527987A
Publication Date:
September 04, 1996
Filing Date:
December 02, 1987
Export Citation:
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Assignee:
TOKYO EREKUTORON KK
MITSUBISHI DENKI KK
International Classes:
G03F7/20; H01L21/20; H01L21/268; H01S3/00; H01S3/10; (IPC1-7): H01S3/10; G03F7/20; H01L21/20; H01L21/268
Domestic Patent References:
JP6341116U
Attorney, Agent or Firm:
Hajime Ohara



 
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