Title:
【発明の名称】電力用半導体モジュール
Document Type and Number:
Japanese Patent JP3361276
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To make it possible to radiate heat surely from a power semiconductor chip in a power semiconductor module. SOLUTION: A power semiconductor module includes a metallic base 2, an insulating plate 4 put on the metallic base 2 and having wiring patterns 8a and 8b on one face while copper foil is applied to the other face, and a power semiconductor chip 6 soldered to one wiring pattern 8a. Then, the power semiconductor module is mounted using a highly heat conductive adhesive for bonding the other face 8c of the insulating board 4 to the metallic base 2. In addition, a first solder bump as large as or larger than the power semiconductor chip 6 is provided on the other face 8c of the insulating plate 4 under the power semiconductor chip 6.
Inventors:
Masahiro Aoyama
Sumio Fujita
Sumio Fujita
Application Number:
JP20866498A
Publication Date:
January 07, 2003
Filing Date:
July 08, 1998
Export Citation:
Assignee:
Sansha Electric Co., Ltd.
International Classes:
H01L23/36; H01L21/60; H01L25/07; H01L25/18; (IPC1-7): H01L25/07; H01L23/36; H01L25/18
Domestic Patent References:
| JP1012812A |