Title:
【発明の名称】高温充填用単層包装材
Document Type and Number:
Japanese Patent JP3090674
Kind Code:
B2
Abstract:
High-temperature materials which are liquid at elevated packing temperatures of 80 DEG C or greater, are introduced in their liquid form into containers formed of polybutylene terephthalate (in film or molded form) at the elevated packaging temperature.
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Inventors:
Shigeru Nezu
Toshio Konishi
Toshio Konishi
Application Number:
JP20483390A
Publication Date:
September 25, 2000
Filing Date:
July 31, 1990
Export Citation:
Assignee:
Polyplastics Co., Ltd.
International Classes:
B65D1/00; B65B25/00; B65B63/08; B65D65/38; C08G63/181; C08G63/183; (IPC1-7): B65D1/09
Domestic Patent References:
| JP5446601U |
Attorney, Agent or Firm:
Kaoru Furuya (3 outside)