Title:
【発明の名称】真空処理装置
Document Type and Number:
Japanese Patent JP2595132
Kind Code:
B2
Abstract:
A vacuum processing system of a type in which wafer cassettes each accomodating a plurality of wafers to be treated are supplied to deliver the wafers and wafer cassettes collecting the treated wafers are taken out. To enable the vacuum treatment, the vacuum processing system has a structure comprising: a plurality of wafer cassettes each being set in the atmospheric air and holding a plurality of wafers to be treated; at least one vacuum processing chamber for effecting vacuum treatment on the wafers; at least one load-lock chamber disposed between the cassettes and the vacuum processing chamber, the wafers being transferred into and out of vacuum atmosphere in the vacuum processing chamber through the load-lock chamber; and a wafer transfer device for transferring the wafers from each of the cassettes to the load-lock chamber and vice versa. The wafer cassettes are arranged on a substantially horizontal flat surface next to each other and each of the cassettes has two stationary positions, and the transference of the wafers from and into each the cassette is conducted at one of the stationary positions. This system can easily be adapted to automatization of production line and can reduce contamination of the products by dust and so forth, whereby a high production efficiency and yield can be attained.
Inventors:
Shigekazu Kato
Tamura direct
Koji Nishihata
Tsunehiko Tsubone
Atsushi Ito
Tamura direct
Koji Nishihata
Tsunehiko Tsubone
Atsushi Ito
Application Number:
JP31781090A
Publication Date:
March 26, 1997
Filing Date:
November 26, 1990
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
B01J3/02; B65G49/07; H01L21/677; (IPC1-7): B01J3/02; H01L21/68
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)