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Patent Searching and Data


Title:
REMOVING METHOD FOR PUNCHING REMAINDER MATERIAL
Document Type and Number:
Japanese Patent JPH076640
Kind Code:
A
Abstract:

PURPOSE: To easily and surely remove only a punching remainder material which is a non-wiring pattern part, in manufacture or the like of a flat wiring body.

CONSTITUTION: Conductor foil 12 is laminated on a surface 4a of a carrier tape 4 through a sticking layer 6, and further the conductor foil 12 is punched to prepare a band-shaped material 17 divided into a wiring pattern part 15 and a non-wiring pattern part 16 which must be removed. This band-shaped material 17 is given a feed intermittently in the lengthwise direction, to stick a reverse surface 4b of the carrier tape 4 to a porous sticking flat plate 26, to also heat by a heater 19 from a side of the reverse surface 4b, and the sticking layer 6 is softened to separate the non-wiring pattern part 16 of the conductor foil 12, while curved, from the band-shaped material 17 (carrier tape 4) (to B direction). By this method, since the band-shaped material 17 can be maintained in a flat plane shape to the porous sticking flat plate 26, to enable sticking force of the sticking layer 6 to decrease by heating, only the non-wiring pattern part 16 can be easily and surely separated to be removed from the band-shaped material 17.


Inventors:
TANNO SHOGO
TAKAGI TOSHIYUKI
Application Number:
JP17120493A
Publication Date:
January 10, 1995
Filing Date:
June 16, 1993
Export Citation:
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Assignee:
MITSUBISHI CABLE IND LTD
International Classes:
B26D7/18; H01B13/00; H05K3/04; H05K3/38; (IPC1-7): H01B13/00; B26D7/18
Attorney, Agent or Firm:
Takeshi Nakatani