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Title:
【発明の名称】X線マスク・ペリクル
Document Type and Number:
Japanese Patent JP3365726
Kind Code:
B2
Abstract:
An X-ray mask pellicle is capable of protecting the X-ray mask from contaminants and the wafer from contact with the X-ray absorber material of the mask. The X-ray mask pellicle is sufficiently thin to allow X-ray exposure at the required mask to wafer gaps yet is sufficiently durable, replaceable, tough and X-ray resistant to be used in X-ray lithography. A thin (organic or inorganic) X-ray mask pellicle to be placed covering the X-ray mask pattern area is fabricated as a thin film and attached to a support ring. A selected area of the pellicle film, tailored to cover the absorber pattern in the X-ray mask, is etched to decrease its thickness to below 2 mu m. If the thin film of the pellicle is not itself conductive, a thin conductive film may be coated on both sides. In an alternative embodiment, the separation between the pellicle and the X-ray mask can be achieved by forming the mask with a stepped profile.

Inventors:
Juan Earl Maldonade
Raul E E Costa
Marie Angelo Paulos
Quad E Dorney
Chandrasekhar Narayan
Andrew TS Pomalen
Jane M Shaw
Kurt Earl Kimmel
Application Number:
JP23570697A
Publication Date:
January 14, 2003
Filing Date:
September 01, 1997
Export Citation:
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Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
Lockheed Martin Corporation
International Classes:
G03F1/22; G03F1/62; G03F1/64; G03F7/20; H01L21/027; G03F1/00; (IPC1-7): H01L21/027; G03F1/14; G03F1/16
Domestic Patent References:
JP4240851A
JP62237727A
JP9306820A
JP1070066A
Attorney, Agent or Firm:
Hiroshi Sakaguchi (1 person outside)