Title:
【発明の名称】フラットな工作物をレーザ加工するための装置
Document Type and Number:
Japanese Patent JP2003522642
Kind Code:
A
Abstract:
A workpiece, designed as a printed circuit board for example, can be moved by means of a transport device under a laser unit in such a way that a region to be machined of the workpiece passes into the deflecting region of the laser beam. The workpiece is set between clamping jaws to a vertical position in which the laser beam is focused exactly on that surface of the workpiece which is to be machined. As a result, the machining accuracy can be considerably increased.
Inventors:
Rotor muller
Daniel Mets
Stephan Dietrich
Daniel Mets
Stephan Dietrich
Application Number:
JP2000559960A
Publication Date:
July 29, 2003
Filing Date:
July 01, 1999
Export Citation:
Assignee:
Siemens Aktiengesellschaft
International Classes:
B23K26/00; B23K26/10; B23K26/02; H05K3/00; B23K101/42; (IPC1-7): B23K26/10; H05K3/00
Domestic Patent References:
| JPH1034370A | 1998-02-10 | |||
| JPH0528582U | 1993-04-16 |
Attorney, Agent or Firm:
Toshio Yano (4 outside)