Title:
FORMING METHOD FOR SOLDER BUMP
Document Type and Number:
Japanese Patent JPS5932154
Kind Code:
A
Abstract:
PURPOSE:To obtain a solder bump simply with plating solution of one type by forming a barrier metal film which is difficult to remove after forming solder in an electrode shape before forming the bump. CONSTITUTION:A protective film 2 is covered except an aluminum electrode 1, Cr, Ni-Cr, Mo or the like is deposited to selectively form the barrier film in an electrode shape. Then, a metal film 4 which is hardly etched at a solder by an etchant for Cu, Ni or Au is superposed thereon, and a bump 6' is formed by solder plating with a positive resist mask which is similarly hardly etched by an exfoliating solution. According to this structure, the bump which has good bondability, high quality in mounting such as bonding strength may be simply obtained.
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Inventors:
OGAWA KENICHI
KAWADA MASAHIKO
KAWADA MASAHIKO
Application Number:
JP14293382A
Publication Date:
February 21, 1984
Filing Date:
August 18, 1982
Export Citation:
Assignee:
SEIKO INSTR & ELECTRONICS
International Classes:
H01L21/60; B23K1/00; (IPC1-7): B23K1/12
Domestic Patent References:
| JPS52102670A | 1977-08-29 | |||
| JPS5469382A | 1979-06-04 | |||
| JPS5224466A | 1977-02-23 |
Attorney, Agent or Firm:
Keinosuke Hayashi