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Title:
IN-MOLD COATING METHOD FOR RESIN MOLDED ITEM
Document Type and Number:
Japanese Patent JPH0615675
Kind Code:
A
Abstract:

PURPOSE: To surely remove flashes from a molded item and uniformly coat the surface with a coating material by a method wherein a resin is compression molded by upper and lower molds having taper parts fitted to each other on the peripheries thereof, the mold is slightly opened before the resin is completely cured, an inclusion of foreign particles is prevented by a gas flow, the flowable coating material is injected, and the mold is clamped for heating and curing the resin.

CONSTITUTION: Slide fitting parts of an upper mold 3 and a lower mold 4 are tapered. A coating material injection member (nozzle) 5 is provided on approximately the center of the lower mold (fixed mold) 4. A molding material is set between the upper mold 3 and the lower mold 4. After the mold is clamped, the molding material is heated. Before the molding material is completely cured, the upper mold 3 is slightly raised for forming a space S between the tapers. Next, a compressed air is fed into a cavity by an air pump 8 for blowing off flashes and foreign particles existing between the half cured material and the lower mold 4 and in the space S. After that, a coating material is injected. At this time, it is preferable that the coating material is so injected as to effusively fill the space S. After the mold is again clamped, the material is heated to be cured.


Inventors:
AZUMA KEIJI
YOSHIDA SHIGEO
MAKI YOSHIKAZU
Application Number:
JP17261192A
Publication Date:
January 25, 1994
Filing Date:
June 30, 1992
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
NIPPON CATALYTIC CHEM IND
International Classes:
B29C43/18; B29C43/20; B29C43/32; B29K105/06; B29L9/00; (IPC1-7): B29C43/20; B29C43/18
Attorney, Agent or Firm:
Ueki Kuichi



 
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