Title:
ATTRACTION DEVICE FOR WAFER
Document Type and Number:
Japanese Patent JPS594135
Kind Code:
A
Abstract:
PURPOSE:To obtain the attraction device for wafer with which photoresist can be applied uniformly on the surface of a wafer by a method wherein an independent air chamber, leading to the air vent located on the external side, and another independent air chamber leading to the air vent on the internal side are provided inside the disk whereon the wafer will be placed. CONSTITUTION:A disk 8 is rotated at approximately 500r.p.m. in its early stages, and the dripped photoresist 6 is spread over the suface of the disk utilizing the centrifugal force generated at that time. At this point, the wafer 4 with minor attracting force is considered effective, and the sucking of the photoresist is performed from a sucking chamber 11 located on the circumference part. As a result, the excessive photoresist 6 is protuberated on the circumferential part of the disk 8, but said excesive photoresist is attracted from the circumferential part only and no attraction is made on the center part of the wafer 4, thereby enabling to prevent the generation of warpage on the wafer. Subsequently, the rotation of the disk 8 is increased to 5,000r.p.m., and the excessive photoresist which is protuberated on the circumferential part is blown away. In this case, the thickness of the applied photoresist can be made uniform by vigorously sucking the photoresist 6 from the entire upper surface of the disk 8 using not only the suction chamber 11 but also a suction chamber 10.
Inventors:
KATAOKA MANJI
Application Number:
JP11461882A
Publication Date:
January 10, 1984
Filing Date:
June 30, 1982
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
H01L21/00; H01L21/68; H01L21/683; (IPC1-7): H01L21/68
Domestic Patent References:
| JPS5537298B2 | 1980-09-26 | |||
| JPS5680141A | 1981-07-01 |
Attorney, Agent or Firm:
Toshimaru Takemoto
Next Patent: JPS594136