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Patent Searching and Data


Title:
ASSEMBLING METHOD FOR MOUNTING MICROCOMPONENT THREE-DIMENSIONALLY
Document Type and Number:
Japanese Patent JPH077132
Kind Code:
A
Abstract:

PURPOSE: To provide a method for mounting/assembling a pin switch part, comprising a beam lead type pin diode and a microchip type capacitor, as an input signal receptor for a radio frequency spectrum analyzer by taking advantage of high speed switching performance and long service life of the pin switch in ultrahigh frequency band.

CONSTITUTION: One beam lead 7 of a beam lead type pin diode is wedge bonded 16 to a microchip capacitor 9 thus constituting a pin switch part 5. The bottom electrode 11 of capacitor is then bonded through a conductive adhesive 12 to the structural base part 15 and grounded. The other beam lead 8 at the pin switch part 5 is placed on the input signal transmission path, i.e., a coupling loop 4, while being superposed on a solder paste ball 13. The solder paste ball 13 is then irradiated with a laser beam 14 and thermally fused thus effecting solder joint.


Inventors:
MORIYAMA TAKEAKI
Application Number:
JP17269693A
Publication Date:
January 10, 1995
Filing Date:
June 18, 1993
Export Citation:
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Assignee:
ADVANTEST CORP
International Classes:
G01R23/16; H01L23/32; H01L25/00; (IPC1-7): H01L25/00; G01R23/16; H01L23/32