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Patent Searching and Data


Title:
ASSEMBLY
Document Type and Number:
Japanese Patent JPS603987
Kind Code:
A
Abstract:

PURPOSE: To provide an assembly which withstands use at a high temp. and has substantial joint strength by subjecting base metal composed of sintered hard alloys to liquid-phase diffusion joining with a filler metal consisting of specifically composed C, B, P, Si, W, Ti, Ta, Nb, Co, Ni, etc.

CONSTITUTION: Base metal consisting of sintered hard alloys divided to a plurality is heated and held at the temp. above the m.p. of a filler metal consisting of 3W13atom% C, 0W19% B, 0W10% P, 0W19% Si, 0W10% W, 0W10% Ti, 0W5% Ta, 0W5% Nb and the balance Co or Co and Ni (where 15W22% B+P+Si) and below the m.p. of the base metal and are assembled by liquid-phase diffusion joining by using said filler metal. The joint assembly of the sintered hard parts which withstands use at a high temp., has substantial joint strength, does not require pressurization at a high temp. and is applicable to intricately shaped parts is thus obtd.


Inventors:
NAKABASHI MASAKO
YAMAZAKI TATSUO
SHIMOTORI KAZUMI
FUJIWARA TETSUO
Application Number:
JP11015683A
Publication Date:
January 10, 1985
Filing Date:
June 21, 1983
Export Citation:
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Assignee:
TOSHIBA KK
International Classes:
B22F1/00; B22F7/00; B23K20/00; B23K20/16; B23K35/30; C04B37/02; (IPC1-7): B23K20/00; B22F1/00; B22F7/00; C04B37/02
Attorney, Agent or Firm:
Noriyuki Noriyuki