Title:
ELECTROFORMING METHOD
Document Type and Number:
Japanese Patent JPS591692
Kind Code:
A
Abstract:
PURPOSE:To increase the deposition speed of plating and to easily manufacture an electroformed product having an internal cooling path, by holding a matrix at the center of a ringlike bent pipe and by uniting them in a body by electroforming. CONSTITUTION:A matrix 4 of Al or the like consisting of a shaft 5 and a gear 6 is held at the center of a copper pipe 1 for a cooling path consisting of a ring part 2 and connecting parts 3. After covering the parts 3 with plugs 7 made of an electric insulator such as plastics, the pipe 1 and the matrix 4 are immersed in an Ni plating soln. 9 in a plating vessel 8 and electroplated to form an Ni block 10 having a prescribed size over the large area of the pipe 1 and the matrix 4 in a short time. Thus, the pipe 1 and the matrix 4 are united in a body by electroforming. The Ni block 10 is cut to the thickness corresponding to the length of the gear 6, and the matrix 4 is dissolved in an NaOH soln. or the like to obtain a cavity 11 having the inserted copper pipe 1 for a cooling path.
Inventors:
YONEYAMA KOUICHI
Application Number:
JP11120582A
Publication Date:
January 07, 1984
Filing Date:
June 28, 1982
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
C25D1/02; (IPC1-7): C25D1/02
Attorney, Agent or Firm:
Takehiko Suzue
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