Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5842246
Kind Code:
A
Abstract:
PURPOSE:To effectively prevent the incoming of moisture from the outside without losing lead strength by a method wherein holes positioning one side or one end at the outside of resin or agreeing the side or end with the side of resin against inner leads are formed. CONSTITUTION:A semiconductor element is fixed to the element fixing section 22 of a lead frame 21 and is further sealed by resin 23 after bonding. Rectangular holes 26 are formed at the inner lead 25 section around outer lead 24 section. The holes 26 in the lead frame 21 are formed so that one side may be located at the outside of the epoxy resin 23 after sealing the resin.
Inventors:
KATAGIRI MASARU
Application Number:
JP14076281A
Publication Date:
March 11, 1983
Filing Date:
September 07, 1981
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H01L23/50; H01L21/60; (IPC1-7): H01L23/12
Domestic Patent References:
| JPS5234945U | 1977-03-11 | |||
| JPS5623765A | 1981-03-06 |
Attorney, Agent or Firm:
Takehiko Suzue