Title:
CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH0697613
Kind Code:
A
Abstract:
PURPOSE: To obtain a printed board of high reliability wherein environmental resistance of the substratum surface is improved, during the manufacturing process and in the long term after manufacturing.
CONSTITUTION: The circuit board is provided with the following; a ceramic substratum, a protective film of 200pm-5nm in thickness which covers the whole part of one surface of the ceramic substratum, and is composed of at least one kind out of Ti, Cr, Ta, Nb, Zr, Mo, W, V, and compound of these metals, and a thin film conductor pattern formed on the protective film.
Inventors:
YASUMOTO YASUAKI
YAMAKAWA KOJI
IYOGI YASUSHI
KOIWA KAORU
IWASE NOBUO
YAMAKAWA KOJI
IYOGI YASUSHI
KOIWA KAORU
IWASE NOBUO
Application Number:
JP24487092A
Publication Date:
April 08, 1994
Filing Date:
September 14, 1992
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H05K1/03; H05K1/09; H05K3/38; (IPC1-7): H05K1/03
Attorney, Agent or Firm:
Takehiko Suzue
Next Patent: MULTILAYER BOARD