Title:
【発明の名称】セラミックパッケージ本体の製造方法
Document Type and Number:
Japanese Patent JP3094069
Kind Code:
B2
Abstract:
In a ceramic package main body having a circuit wiring provided to a ceramic substrate and including first and second independent circuit wires, first and second conductive layers are formed on the ceramic substrate. A first connection wire is provided to connect between the first circuit wire and the first conductive layer. A second connection wire is provided to connect between the second circuit wire and the second conductive layer. The first and second conductive layers are electrically insulated from each other for enabling to examine an electrical connection between the first and second conductive layers and determine, from the result of the examination, whether a short circuit is developed between the first and second circuit wires.
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Inventors:
Kozo Yamazaki
Naomika Kato
Naomika Kato
Application Number:
JP34766493A
Publication Date:
October 03, 2000
Filing Date:
December 24, 1993
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H05K3/46; H01L21/48; H01L21/66; H01L23/12; H01L23/13; H01L23/498; H01L23/64; H05K3/00; (IPC1-7): H05K3/46; H01L23/12; H05K3/00
Domestic Patent References:
| JP6442899A | ||||
| JP2309694A | ||||
| JP5534662U |