Title:
【発明の名称】細溝付き成形基板の製造方法
Document Type and Number:
Japanese Patent JP3104699
Kind Code:
B1
Abstract:
A substrate 3 on which a photoresist 2 is coated is exposed to an exposure light along a line through a lens 1. Then, the exposure position is moved from the initial position O1 to the position O2 apart from a distance corresponding to a summation of a groove width Gw and a land width Lw. The exposure is carried out along a line parallel to the initial exposure line, and with repeating this, exposed areas 2e having a width Lw and a separation Gw are formed on the resist 2. Then, the resist is developed, the exposed areas 2e are removed, resin or the like is pressed on it, and a replica is formed. From the replica, a stamper is, then, manufactured by using an electroforming method. Finally, a grooved molding substrate is manufactured from glass or resin by using the stamper. Although the land width Lw is defined by the effective spot diameter DIAMETER of the optical system, the groove width Gw can be less than this value.
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Inventors:
Madoka Nishiyama
Seiji Morita
Seiji Morita
Application Number:
JP15327899A
Publication Date:
October 30, 2000
Filing Date:
June 01, 1999
Export Citation:
Assignee:
NIKON CORPORATION
International Classes:
B29C33/38; B29C45/26; B29D17/00; C25D1/10; G11B5/82; G11B5/84; G11B7/24073; G11B7/24079; G11B7/24085; G11B7/26; (IPC1-7): B29C33/38; B29C45/26; G11B5/82; G11B5/84; G11B7/24; G11B7/26
Domestic Patent References:
| JP896426A | ||||
| JP59180801A | ||||
| JP6302018A | ||||
| JP973653A | ||||
| JP11501434A |
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