Title:
【発明の名称】樹脂封止用金型および半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2885708
Kind Code:
B2
Inventors:
MORI NOBUYUKI
Application Number:
JP20065496A
Publication Date:
April 26, 1999
Filing Date:
July 30, 1996
Export Citation:
Assignee:
KYUSHU NIPPON DENKI KK
International Classes:
B29C45/26; B29C45/02; B29C45/14; H01L21/56; B29L31/34; (IPC1-7): H01L21/56; B29C45/02; B29C45/14; B29C45/26
Domestic Patent References:
| JP5267375A | ||||
| JP4257410A | ||||
| JP61170038A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)