Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2622588
Kind Code:
B2
Inventors:
Shunji Nakamura
Application Number:
JP16663388A
Publication Date:
June 18, 1997
Filing Date:
July 04, 1988
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L29/78; H01L21/336; (IPC1-7): H01L29/78
Attorney, Agent or Firm:
Kugoro Tamamushi (1 outside)