Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2903594
Kind Code:
B2
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Inventors:
DAIMON TADASHI
Application Number:
JP2673390A
Publication Date:
June 07, 1999
Filing Date:
February 05, 1990
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L21/336; H01L21/265; H01L21/266; H01L29/78; (IPC1-7): H01L21/266; H01L21/265; H01L21/336; H01L29/78
Domestic Patent References:
| JP60189251A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)