Title:
【発明の名称】薄膜状半導体装置の作製方法。
Document Type and Number:
Japanese Patent JP3122699
Kind Code:
B2
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Inventors:
Shunpei Yamazaki
Application Number:
JP19193493A
Publication Date:
January 09, 2001
Filing Date:
July 06, 1993
Export Citation:
Assignee:
Semiconductor Energy Laboratory Co., Ltd.
International Classes:
H01L21/20; H01L21/26; H01L21/265; H01L21/268; H01L21/316; H01L21/336; H01L29/78; H01L29/786; (IPC1-7): H01L29/786; H01L21/26; H01L21/268; H01L21/316; H01L21/336
Domestic Patent References:
JP62119974A | ||||
JP63105970A | ||||
JP1238024A | ||||
JP4110470A | ||||
JP5898933A | ||||
JP3132041A | ||||
JP334434A | ||||
JP58118154A | ||||
JP58147070A | ||||
JP324717A |
Attorney, Agent or Firm:
Takehiko Suzue (6 outside)