PURPOSE: To easily remove projections having a small difference from recesses in a lapping method and a surface polishing device fitted with a work having irregularities on the surface and selectively removing the projections.

CONSTITUTION: A work 1 fitted to the head 6 of a surface polishing device is pressed to a lap 2 on a turntable 3, and the projections on the surface of the work 1 are selectively lapped when the lap 2 is rotated in this lapping method. The head 6 is provided with a means making the temperature on the surfaces of the projections of the work 1 higher than the temperature in the other region at the time of lapping, the lapping speed of the projections is made larger than that of the other region, and selective lapping is facilitated.