Title:
LAMINATE FILM
Document Type and Number:
Japanese Patent JPH0655713
Kind Code:
A
Abstract:
PURPOSE: To furnish a laminate film which can be thermocompression-bonded directly with a copper leaf and is excellent in heat resistance.
CONSTITUTION: A laminate film formed by laminating a layer B constituted of aromatic polyamide or resin which is prepared by blending the aromatic polyamide with soluble resin and of which the softening temperature is in the range of 170°C to 240°C, at least on one surface of a layer A constituted of the aromatic polyamide or blended resin of the aromatic polyamide and the soluble resin.
Inventors:
YAMAKAWA TAKAMICHI
ITO NOBUAKI
ITO NOBUAKI
Application Number:
JP23156692A
Publication Date:
March 01, 1994
Filing Date:
August 07, 1992
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
B32B27/00; B32B15/08; B32B15/088; B32B27/34; H05K1/03; (IPC1-7): B32B27/34; H05K1/03
Attorney, Agent or Firm:
Ban Toshimitsu
Next Patent: LAMINATED PACKAGING MATERIAL