PURPOSE: To provide an IC package plating frame and a method of dismounting it, wherein the IC package plating frame can be pulled out from the pins of an IC package without causing damage to the Pins.

CONSTITUTION: An IC package plating frame is equipped with a pin holder 3 where a large number of pin insertion holes 4 which hold the tips of the pins 2 of an IC package 1 are bored at positions corresponding to the pins 2 of the package 1, wherein a slot 5 is provided to the peripheral side of the pin insertion hole 4 so as to communicate with the pin insertion hole 4, and a small hole 6 is provided to the halfway point of the slot 5.